CHIPTRONIKS , A Division of VD Intellisys is Authorized Distributor of JOVY SYSTEMS BGA REWORK STATIONS in India . For more details visit http://www.bga-rework.in or call 09971004998
BGA Rework Station
BGA is short for Ball Grid Array. It is a kind of package method which use organic carrier in IC. It has the following features:
1. Small package area.
2. Greater functions and more pins
3. Self-centerize while PCB puddle welding, easy to put on tin.
4. More reliable.
5. Good conductivity and low overall cost. Memory which applies BGA can enlarge the memory capacity by 2 to 3 times while the volume of memory remains the same. Compared with TSOP, BGA is much smaller and better at radiating and conducting electricity.
Types of BGA
According to the encapsulation material, BGA can be classified into the following types:
Features of BGA
Compared with QFP, BGA has the following features:
BGA Rework Process
Most of the semiconductor device’s heat-resistant temperatures are between 240°C and 600 °C. Therefore, the control of the temperature and uniformity are very important to BGA rework systems. BGA rework process as follows:
Mounting: The main purpose of mounting to make every BGA solder align to the PCB pad with special equipment.
Hot air reflows: Hot air reflow soldering is the key to the whole BGA Rework.
In order to ensure the validity of BGA Rework Station, the installation should meet the following requirements.
Bga Power supply:
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