This has been developed  for lead free soldering with wise touch technology and concept of  “variable power for variable temperatures”.
invincible, control using the tip for sensing the thermal energy requirements for the target precisely when it touches the solder joint surface, and prevents overshooting without any calibrations.
intelligent, the auto-power regulation and recovery control provides the different temperature levels needed for melting any type of solder material alloys at any volume.
Auto sleep mode and auto standby mode implemented for power saving and longer tip life time.
inconceivable, the easiest operating method exists for soldering stations, by two colour led indicators with four operating modes.

iSolder-40, is the combination of fashionable design and ease of use hand –piece for more control and comfort.

Specifications

Power Supply
Ambient Operating Temperature 10 – 40°C
Maximum Enclosure Temperature 65°C
Input Line Voltage 120/230 VAC
Input Line Frequency 50/60 Hz
Power Consumption 50 Watts max.

Hand piece
Tip-to-Ground Potential < 2 mV True RMS, 50-500 Hz
Tip-to-Ground Resistance < 2 ohms DC, unit on
Idle Temperature Stability ± 1.1°C in still air

The components that make a CCTV or a Closed Circuit Television System are single or multiple cameras, a monitor and a recording device. Well, a CCTV system can be divided into two types- the wired CCTV system and the wireless CCTV system. As is quite evident from the name, the wired system joins the above mentioned components together with cables whereas, the wireless one has no monitor or a recording device connected to it. Each of these types have there own advantages and disadvantages with respect to the technology involved in them. Get an insight on both types.

Wireless CCTV Systems
This system has gained popularity because it is an easy to install system. Lack of cables increases its value in terms of mobility. There are some key advantages of this system:

* One obvious advantage is that, it is easy to move the camera to the place that requires observation. Well, it is difficult to move a wired camera as per your requirement.
* This system is a great option for the places that require temporary observation. They can also be installed at temporary sites.
* This camera in this system can be hidden too. This would help check theft and other kinds of crimes.
* In this system, the recording and the monitoring device need not be in the same line of sight to provide an observation from another remote location.
* This system is not very expensive and is advantageous because it can be moved and deployed as per choice.

With a number of advantages, this system has a number of disadvantages too:

* The wireless CCTVs require a high frequency for recording to take place in the recording station.  Disturbed frequency would mean low quality footage.
* These cameras are observed to have low picture quality.
* The camera in the wireless CCTV system may require an electricity connection despite the video being connected wireless.
* The breakdown with this system is not easily detectable and requires only experts to do the job!

Wired CCTV Systems
In this system the three components, the camera, the recording device and the monitor are connected with the help of a cable. This system is advantageous because:

* It offers good picture quality.
* The cameras can be a located a few meters away from the monitor.
* A single power supply is enough to control all the sensors.

The main disadvantages of this system are:

* This system requires time and man power to be installed.
* It has a limited range of observation and cannot be easily moved from its place.

Both the systems have their pros and cons. The wireless one because of its viability is preferred by many but the wired one is a choice for those who want clear pictures and have a limited budget.

Call CHIPMENTOR for CCTV installation at your door-step !!! call 011-43464998

Jovy System released latest dark infrared BGA rework stationmodel: Jovy Re-8500,different withJovy Re-7500, Jovy RE-8500 with much larger working platform,it can repair any size PCBA up to 500x450mm and any dimension matrix. CHIPTRONIKS is the official agent for  these machines in India . For any enquiry , call +91 9971004998.

Jovy re-8500can be widely used as below fileds:
Business field
• Laptop and mother boards rework and repair.
• Game consoles applications rework and repair.
• Small and medium size electronics assembly factories.
• Military sophisticated applications rework and repair.
• Medical equipment applications rework and repair.
• Automotive applications rework and repair.
• Light systems and LED applications.
• Home appliance and personal Gadgets applications rework and repair.
• Networking and communication applications rework, repair and assembly.
• Power supply and control PCB applications rework, repair and assembly.

Components type
• BGA on Flex printed circuit.
• PTH connectors, card slots and sockets.
• Metal components housing.
• Micro lead frame.
• PBGA with heat sink.
• Processor plastic sockets.
• Metal Shielding.
• CSP and fine pitches BGA.
• Plastic PLCC.
• Through hole sockets.
• Heavy Mass CCGA & CBGA.
• Underfill or epoxy coated components.
• QFN, VQFN and advanced design QFN.
• Package over package (POP).

Below is the outstadning features for Jovy RE-8500 BGA rework station:
1..Jovy RE-8500 with USB to connect to computer, it is more convenient.
2.Jovy RE-8500 with more human operating button, and no need to stoop you can get things under control because you can stand straight to press the buttons.
3.Jovy re-8500 BGA rework station is equipped with 4pcs thick steel cover with different size holes in middle. They help to rework components with different size and protect the surrounding small components not damaged by the powerful heat.
4.It is with 5 thermocouple slot to bring more accurate temperature detection.
5.The upper heating head can move up and down to satisfy different temperature demand.

In this article , we will compare between various bga rework station.In the BGA rework area, hot air heating and infrared heating are the most normal repairing technique, so, what is the differences between them? We will read in this article the major differences . One must be aware of the application for which he needs bga rework stations.

Infrared rework stations have  become very popular in the reworking field. Many small rework stations are designed with infrared heating, owing  to the advantage that infrared heating has no air flow. We do not need to be afraid of blowing away small ICs on the board when we are reworking. On the other hand, infrared heating can do even heating, which makes the stuff warm with average heat.

The the shortcoming is that the temperature of infrared rework stations ups slowly in the beginning , and when the temperature is up to a specify point, it will be hard to control, on the other hand, after you finish rework, you have to wait for a while for the temperature cool down. But then Infrared Bga rework stations like RE7500 and RE8500 distributed by V D Intellisys Technologies Pvt. Ltd(www.bga-rework.in) had removed this limitations also.

About the hot air system:

For the hot air gunheating, the temperature of hot air can change easily, but it is hart to adjust too, thus, users should choose a high quality hot air rework station with nice controller and can do excellent air flow.

Some hot air guns are with rotating  air flow, the flow is average because of the design of the air nozzles. Hot air soldering have an other advantage that hot air have a pressure can make the chips or IC more closely to the PCB.

But then it has a flip side also , the chips or IC may be popcorn because of not technical control of the temperature, or the ICs can be blown away by the strong air flow, so , hot air guns are suited for the ever technical rework masters.

Now the most hot selling infrared heating rework stations are: RE 7500 & RE8500 distributed by V D Intellisys Technologies Pvt.Ltd .

According to our experience ,we suggest infrared bga rework stations .

The price ranges from difference demand of user, generally speaking, hot air guns are cheaper but suits for technical workers, infrared rework stations and hot air infrared heating stations are suit for the one who just star learning how to solder.

BGA rework just is a way of learning that never end, we may failed when we solder but we get experience from them, hope I can also get some tips from you.

If you decide to buy bga rework stations , you can call for any consultations on +91 9971004998

We will start talking a bit about the differences in reballing methods and elements used.
Remember this chapter here is only about the reballing part, not about profiles, temperatures or which machine to use.
In reballing there are 2 procedures, the NETS or STENCILS procedures.

The NETS procedure is often called Direct Heat procedure as the NETS rest without support on top of the chip (Not because the NETS can withstand more heat – That is a myth -). You usually pour balls on it by holding it with your hands or tweezers if you are capable of doing it and you use an anti-static anti-acid Bowl on the bottom to pick up the balls that do not fit, then with a Squeegee ( Squeeze pen or reballing Pen ) you try to put all the balls in place.

NOTE: Because is called direct heat procedure does not mean the nets resist more heat than stencils, is all in the way you use the elements ( heat and wind ) properly that makes a good procedure, Stencils are supported by a base and goes with a lot of are that can bend, but only because your application of heat is not properly made. So there is no difference on the material used to make nets or stencils.

TIPS ON THIS PROCEDURE: Clean very well the chip before you start doing the reballing; first with your Soldering Iron, a tip type K ( Knife ) or D ( Drag ) and your tin line, then some use acetone , alcohol , branded rust cleaner or antioxidant liquid (or both) usually for this, remember to use gloves and mask if you are using fluxes and acetone with odor and fumes. If you have pads damaged on your chip, that is not because of your popping up process, some chips deteriorate like that naturally and lose pads, you can remake them or replace the chip on that case, do not reball a chip with pads lost (It is a recommendation not a must do)

PROCEDURE: After the chip is all cleaned and rested for a couple of minutes, use a thin layer of flux (remember this is a lubricant and anti rust substance, if you apply too much will flood your procedure and you wont be able to put your balls in place) , you can apply with the same squeegee or a plain instrument, then place the net on top of the chip, be patient and make sure you go with the guide corners in each chip, and make sure is all perfectly located, you can use some kapton tape on the sides of the chip to hold to the net to help you once is placed to not be moved. Then pick up the chip with the net on it and pour the balls having a bowl below your hand so you don’t lose balls. After this, rest your chip on a cardboard or plain surface and try to make all the holes on the net have a ball on it and remove the extra balls that will not be used, you can use the soldering tip i or B for this issue too (without the soldering iron being turned on, just for the remove of the extra balls only as cold tool).
After this is done you are ready to fit the balls into the chip, remember you are not going to melt them completely, you will just fit them in the contacts, your full fixing is to the main board not to the chip, you will do a quick fit right now, you will place the chip in a place that can receive heat and then blow some hot air on top of it, about 180 to 190 degrees if you are using Leaded, about 220 to 230 degrees if you are using unlead. Use your hand properly as you are doing a spiral around the chip, like serving an ice cream cone from a machine. until you see the balls in place. Let the chip rest again, and the remove your net, you can use a blower or air pump with no heat to check for the balls to be all in place. So, your chip is fit again and ready to go to your mother board.

FINAL COMMENT: Please be patient, the main rate of failure in these procedures is due to the lack of patience by the operator. Reballing, Rework and Re-flow is not a quick buck of this century, is a service you are doing to your customer, that requires practice, dedication and patience, if not your boards will return in a month or two weeks to you.

DISCLAIMER: This procedure is not universal, and there are many ways and personal variables that can work for each operator, please use the forum of ” Experiences ” or this topic to make your own comments and how works for you. There is not full profiles or procedures in repairs, some operators use personal variables and again practice make masters on this, never get frustrated because it does not work for you at the beginning, you need to practice, like in a fine musical instrument, you will tune up with time and dedication.

THE WRITER OF THIS POST IS A NOT FLUENT ENGLISH SPEAKER AND ENGLISH IS NOT HER FIRST LANGUAGE, THIS POST IS WRITTEN IN AN INFORMAL WAY.
THIS PROCEDURE POST IS UNEDITED AND IS SUBJECTED TO CHANGES AND EDITIONS WITHOUT NOTICE.

Thank you for your reading.
Linda Wu
Dragon Group China
Technical Support

Figure.1 – Layout of the reverse socket

1. Overview of Reverse Socket
A reverse socket is a recovery tool to fix a suface mounted PLCC32 Flashrom without Reworks-tool.
You can fix a suface mounted PLCC32 Flashrom without soldering(or simple soldering with basic tool).
Reverse socket has two mode and three usage according to target application.
※ Definitions:

· Primary flashrom : BIOS flashrom that soldered to motherboard

· Secondary flashrom : A spare flashrom to boot with reverse socket

· Flashrom Swap : Transferring a Primary flashrom interface to Secondary flashrom

· Pin bypass : to disconnect the circuit between existing components and creating a necessary connection

· Pin cutting : to cut a leg of Primary flashrom, it makes a new connection

2. The principle of Reverse Socket
Question : Is it possible to update a Primary flashrom that is direct connected to any programmer?

Answer :   No, it is impossible.

As shown below, soldered flashrom is connected to many other unknown device in motherboard.
So, when programmer tries to handle a flashrom, BUS fall in unknown status by these unknown devices.

Figure.2 Simple connecting structure of BIOS Flashrom and Motherboard

Figure.3 concept – When flashrom was connected directly to programmer

without disconnecting from the motherboard, unintended connection is created.

At worst case, if power is overloaded, motherboad, power unit, programmer, flashrom and on board the various
components (CPU, memory, VGA, Harddisk…) can be breaked.
So, you should never ever try this.
We need a new method, and one of simple method is adding of new flashrom.

Figure.4 concept -  adding of new flashrom, Red-line is reverse socket.

At this case, we have to make the Primary flashrom disable before attaching the Secondary flashrom.
So, reverse socket must have a function that can make Primary flashrom disable.
In this way, motherboard can boot to OS by Secondary flashrom.
After booting, we have to disable Secondary flashrom and enable Primary flashrom in POWER-ON status.
In this status, we can update(or fix) Primary flashrom with BIOS update tool of motherboard manufacture.
(BIOS update tool : AWDFLASH, WINFLASH, PHLASH,AMIFAUTO, FLASH85x, AFUDOS, AFUWIN, UNIFLASH…)
As a result, you can make a status to fix a BIOS with reverse socket.
And you should understand reverse socket has two functions.
· to disable/ebable Primary flashrom and Secondary flashrom.
· to make a connection between Primary flashrom and Secondary flashrom without soldering.
3. Type of Reverse Socket 

3.1. FWH/LPC recovery : use when Primary flashrom has FWH / LPC interface
-> See usage.1 and usage.2
feature of usage.1 :  depending on motherboard design, does not require a soldering operations.
feature of usage.2 :  not depending on motherboard design, needs a Pin-cutting operations.
Rarely, depending on the type of flash ROM may need simple soldering operations.

Figure.5 FWH/LPC mode of reverse socket

3.2. Legacy Flashrom recovery : use when Primary flashrom has legacy interface
-> See usage.3
feature -  Needs a Pin-bypass operations.
Pin-bypass operations just needs a simple soldering tool.

Figure.6 Legacy mode of reverse socket
※ FWH/LPC mode and Legacy mode can be switched by replacing components.
See positions of four chip resistance of left side.

4. Using a Reverse Socket  

4.1. usage.1

Parts needed : FWH / LPC mode reverse socket, A secondary flashrom that is same(or compatible) with the Primary flashrom

Conditions of Use :

a. Use only with FWH/LPC flashrom (Wrong usage can break device)

b. Measure resistance next 4 pin(ID0 to ID4) and GND of Primary flashrom.
If all value are under 600Ω, goto usage.2
Any value are over 600Ω, you can go with usage.1

Figure.7 compatibility test
Usage :

a. Write a correct BIOS to Secondary flashrom.
b. Insert Secondary flashrom to Top socket of Reverse socket

Figure.8  Insert Secondary flashrom to Top socket of Reverse socket

c. Attach Reverse scoket to Primary flashrom on motherboard.
(Warning : Primary flashrom and Secondary flashrom have same direction.)

Figure.9  Attach Reverse scoket to Primary flashrom on motherboard

Figure.10  picture attached reverse socket to the primary flashrom
d. to enter into the OS by booting the motherboard.

(recommended to copy a BIOS update tool and BIOS file to harddisk before boot)

e. OS is fully booted and ready to run the BIOS update utility and
Remove the reverse socket from Primary flashrom.

Figure.11  Remove the reverse socket from Primary flashrom after boot

f.  Recover a Primary flashrom by BIOS update tool.

g. Reboot the motherboard and make sure the repair properly.

4.2. usage.2

Parts needed : FWH / LPC mode reverse socket, A secondary flashrom that is same(or compatible) with the Primary flashrom
Tools needed : small paper knife, pincette or solder iron.

Conditions of Use: 

a. Use only with FWH/LPC flashrom (Wrong usage can break device)vl

b. Necessary only :  ’usage.1′ is not working. see usage.1.

How to use:

a. Pin-cutting must be applied to one pin of next four pin of Primary flashrom.

Figure.12 How to do Pin-cutting

b. Write a correct BIOS to Secondary flashrom.

c. Insert Secondary flashrom to Top socket of Reverse socket.

d. Attach Reverse scoket to Primary flashrom on motherboard.
(Warning : Primary flashrom and Secondary flashrom have same direction.
Recommended to measure a isolation between the cutted pin and GND.)

e. to enter into the OS by booting the motherboard.

(recommended to copy a BIOS update tool and BIOS file to harddisk before boot)
f. OS is fully booted and ready to run the BIOS update utility and
Remove the reverse socket from Primary flashrom.
g.  Recover a Primary flashrom by BIOS update tool.
h. Reboot the motherboard and make sure the repair properly.

e. If the BIOS tool reports ‘updating was success’,
but motherborad does not boot, recover cutted pin by soldering.
4.3. usage.3
Parts needed : Legacy flashrom mode reverse socket, A secondary flashrom that is same(or compatible) with the Primary flashrom

Tools needed : small paper knife, pincette and solder iron.

Conditions of Use:

a. Use only with Legacy flashrom flashrom (Wrong usage can break device)

b. Pin-bypass operations and recovery operations are required.

How to use :

a. Pin-cutting must be applied to one pin of Primary flashrom in next illustration.

And remained pattern must be connected to CS point on reverse socket.
(Warning : each soldering point must be isolated electronically from near pin.)

Figure.13 How to do Pin-bypass

b. Put jumper of reverse socket to 2-3 position.

c. Write a correct BIOS to Secondary flashrom.

d. Insert Secondary flashrom to Top socket of Reverse socket
e. Attach Reverse scoket to Primary flashrom on motherboard.
(Warning : Primary flashrom and Secondary flashrom have same direction.)
Recommended to measure a isolation between the CS point and number 1-pin of jumper)
f. to enter into the OS by booting the motherboard.
(Recommended to copy a BIOS update tool and BIOS file to harddisk before boot.
If motherboard can’t boot, check a connection of reverse socket or BIOS file.)

g. OS is fully booted and ready to run the BIOS update utility and
Move jumper to 1-2 position.
h.  Recover a Primary flashrom by BIOS update tool.
i. Reboot the motherboard and make sure the repair properly.
j. If motherboard can boot, recover cutted pin with soldering.

In this article , Mr. Amit of CHIPTRONIKS will discuss the  NOKIA UEM ASIC Type

HP Printer Error Codes

Error 02 Warming up
 Turn printer off. Unplug I/O cable from rear of printer. Power up printer and see if it goes to ready. If printer goes to ready, the problem could be a driver issue, a bad I/O port in the computer or a bad I/O cable. If the printer still stays in 02 warm up, replace the formatter board.

Error 11 Paper Out
 Check paper tray for paper. Make sure it is seated properly.
 Check the tray size actuating tabs on the paper tray for damage. Check to see if the actuators they contact aren’t bent. The micro-switches they actuate could be defective or misaligned. Manually depress the actuators and listen for a click.
 Check that the paper sensor arm isn’t stuck or broken.
 Paper Control Sensor PCA is defective.

Error 12 Printer Open no EP cartridge
 Check that the toner cartridge is installed.
 Check that the top cover is firmly closed.
 On HP II/IID/III/IIID printers this error is usually caused by a bad DC power supply.
 On HP IIP/IIP+/IIIP printers the primary cause is the density adjusting PCA. There is a slight possibility of it being a bad fan. There is also a slight possibility of the tab on the fuser access door above the MP tray breaking off and causing the error. If the fan starts to run, quits and you notice a burning odor, the scanner motor has failed and needs to be replaced. The problem can also be caused by a defective drum shutter on the toner cartridge.
 On the 4/4M/4+/4M+ the tab on the top cover that actuates the door interlock could be broken.

Error 13 Paper Jam
 Paper jams can occur in 3 places: Entry, registration and exit.
 If the paper isn’t picking up out of the paper tray, visually inspect the pickup roller. If it looks shiny, replace it. You should also replace the separation pad as they work together. On the 4L/4P/5P/6P the pickup roller has a plastic shaft that breaks. You’ll have to replace the whole pickup assembly. This requires major disassembly of the printer.
 If you have an HP 4/4+/5 with an optional 500 sheet feeder that’s jamming, check the balance knob adjustment. Center it with a full ream of paper for proper operation.
 If the paper is jamming at registration or anywhere between pickup and exit it could be a number of things. Check the paper path for torn bits of paper or label residue. On the II/III series, remove the metal registration guide plate (2 screws) and check underneath it. If the pickup rollers are moderately worn, the paper will stop just short of the registration roller. On the 4L/4P/5P/6P remove the screw holding the oblique roller assembly (Inside front of printer) and pull out and inspect the assembly and the area under it. On the HP 4/4+/5 pivot up the metal plate and check underneath it. Check the roller assembly on the left side for torn scraps of paper (a flashlight or torch is necessary).
 Make sure paper cassettes are firmly seated, corner tabs aren’t bent. Some trays have lifting springs that could pop out if tray has been dropped.
 On HP IIP/IIP+/IIIP printers if the paper scrunches up at the toner cartridge you’ll need our Inside Accordion Jam Repair Kit.
 Check your software settings in the program you are attempting to print from. Do you have the correct paper size specified? If you have a different paper size than what is in the tray, you’ll get a paper jam.
 Exit jams are frequently caused by exit sensors. These sensors are typically mounted on the fuser assembly or adjacent to it. They are plastic arms that block and unblock an optical sensor. The arms can get stuck or knocked out of place when clearing paper jams. The optical sensors can also get dirt blocking the photo cell. Clean the sensor and check for free movement and proper installation of the sensor arms.
 On HP II/III series exit jams are mostly caused by worn gears. The best way to troubleshoot this is to defeat the door interlock (see door interlock photo on troubleshooting page). Press down on the arm on the top right of the fuser. Initiate a test page. While holding down the arm, press one of the metal cartridge detect switches just below the door interlock. Watch the movement of the gears. You will get a 51 error because the door is open. Recycle power to get rid of error. There is an arm gear on the lower right of the fuser that can shed teeth. There is also a 14 tooth gear below the large gear on top of the fuser. You can also manually rotate the large gear and check for binding or crunching. If that happens, then replace the 14 tooth gear. On the door, there are some delivery coupler gears that mate with the fuser and drive the exit roller. Check the gears for excessive wear. Replace if necessary. If the paper gets almost all the way out and jams, replace the exit roller or the exit roller assembly. If the error occurs after fuser replacement, check and see if the connector on the left of the fuser is properly mated with the one in the printer.
 On HP IIP/IIP+/IIIP printers if the paper has accordion folds on the bottom and jams on exit, order our Top Output Accordion Jam Repair Kit.
 On HP 4/4+/5 printers the most common cause of exit jams is the exit assembly.
Exit jams in the fuser can be caused by a broken fuser drive gear or a broken gear on the fuser. Remove the fuser and check the gear inside the printer for broken teeth. Manually turn the gears on the fuser and check for smooth operation. Check the paper exit sensor arm for proper mounting and free movement.
 Check to make sure the rear door is closed on the printer. Open doors can cause 13 paper jam indications.
 On the 5L/6L check the registration sensor arm below the pickup roller. Also check the exit sensor arm (bottom center of the fuser). These arms frequently get stuck or dislodged clearing paper jams.
Error 14 No EP cartridge
 Check that a toner cartridge is installed and fully seated.
 On HP II/III and IISi/4Si models check that at least one sensitivity tab is installed on the right side of the toner cartridge. If you see 2 holes and no square plastic tabs sticking in at least one of them, the printer will not see the cartridge. If one tab is installed and the printer still doesn’t recognize the cartridge, try popping out the tab and putting it in the other position.
 On HP 4/4+/5 printers the high voltage contacts can be dirty or misaligned. If contacts are ok, replace the high voltage power supply.

Error 16 Toner low
 Toner cartridge is low on toner. Try gently rocking the cartridge to redistribute the toner. This will buy you 50-100 pages. Get a new cartridge as soon as possible.
 Dirty or misaligned contacts on the high voltage power supply.
 On the HP II/III printers it can be a loose connector on DC controller see tweaking for instructions on how to repair it.
 On the HP 4/4+/5 printers there is a potentiometer adjustment on the left side of the printer. You have to remove the left panel and you’ll see it. It’s located at about the exact center of the printer.

Error 18 MIO Not Ready
 The printer is not connected to a Lan.
 The MIO (Jet Direct) card is defective or not seated correctly. Reseat or replace it. If you have another printer with the same card, try swapping them. Always turn printer power off when removing or inserting cards.

Error 20 Memory Overflow
 Print job has exceeded the memory capacity of the printer. Simplify the print job, reduce the dpi setting or install additional memory. See our specials page for memory.

Error 21 Print Overrun
 See error 20

Error 22 I/O Configuration
 Printer or computer I/O configuration is incorrect
 I/O cable is wrong or damaged
 The computer is switched off
 I/O port on printer is damaged. Replace the formatter.

Error 23 I/O Not Ready
 I/O card can’t accept data or isn’t connected to the network. Check card seating (with power off) and replace if necessary.

Error 24 Job Memory Full
 Too much data or too complex data for printer memory. See error 20.

Error 25 XXX Memory Full
 Too much data or too complex data for printer memory. See error 20.

Error 30 PS Error 16
 I/O time out. Printer got tired of waiting for user interaction like a manual feed. Check the I/O connections. Check display panel for media request.

Error 30 PS Error 22/25
 Postscript error. Replace the Postscript SIMM module
Error 30 PS Error (all others)
 A PCL file was sent to the printer while it was in Postscript mode.
Error 30.1.1 Disk Failure
 5si/8000 optional hard drive has crashed. Press select to continue.

Error 40 Data Transfer Error
 Printer and computer may be set to different baud rates.
 The computer is turned off.
 The MIO card is defective or improperly seated.
 Press continue or go on the printer to clear message.

Error 41 (temporary print engine error)
 Temporary error has occurred. Press Go or Continue. Power cycle the printer.

Error 41.1 41.2 41.3
 Defective connections. Reseat J205,206,207 and laser scanner connectors.
 Paper multifeed or wrong size paper being used.
 Paper size selection doesn’t match the paper being used.
 Cassette is overfull or improperly adjusted.

Error 41.4 or 41.5
 Formatter PCA or DC controller is defective.

Error 50 (fuser malfunction)
 HP II/III series most likely cause is the ac power module is defective. Slight possibility of loose connector on DC controller. See tweaking page DC controller could also be defective, but this is very rare.
 HP IIP/IIP+/IIIP most likely cause is burned out quartz lamp. Could also be a failure of the power supply.
 HP 4/4+/5 most likely cause is burned out quartz lamp. Could also be a failure of the power supply.
 HP 4L/4P/5L/5P/6L/6P most likely cause is a bad ceramic heating element.
 All other printers most likely cause is burned out quartz lamp. In rare instances the ac power supply has failed. Even rarer, the DC controller is defective.

Error 51 (beam detect error)
 HP II/III series see tweaking page. Check the tab on the bottom of the toner cartridge facing you as you open the printer. If it’s broken off it won’t open the laser shutter. Check fiber optic cable for kinks or other damage.
 HP IIP/IIP+/IIIP could be either the laser pca or the scanner motor. Listen for erratic sounding scanner motor. There is a tab on the front of the toner cartridge that could also cause the problem. If its damaged or worn, it won’t open the laser shutter. Check fiber optic cable for kinks or other damage.
 All other printers, replace laser scanner assembly.

Error 52 (scanner motor malfunction)
 HP II/III series see tweaking page.
 All other printers, replace laser scanner assembly.

Error 53 (accessory memory error)
 All printers replace bad memory board or defective SIMM. See specials page.

Error 54
 Defective duplexer.

Error 55 (internal communication problem)
 On the HP 2 series you have to replace both the dc controller and formatter boards. On all other printers it can be several things: DC controller, formatter, main motor

Error 56
 On the IID/IIID the output selector knob on the rear assembly is not in the duplex position. On the IIISi/4Si a command was sent to print envelopes while the printer was in duplex mode.

Error 57
 6L/5L Memory card incompatibility – 1,2,4,8 MB, 5 volt, 70 nanosecond or faster
 6P/5P/5 Improper main motor function, check gear train for binding. Check DC controller connections – replace main motor
 4L/4 Main motor problem, check gear train for binding. Replace main motor
 IIIP/IIP+/IIP Error 57-1 Incompatible memory can be either in the top or bottom slot. Also check motor cable connections. Replace main motor. Can also be a defective DC controller.
 5Si/4+/4Si/IIISi (X=2, 3 or 4) Fan motor is defective, check fan number X or duplexer fan and replace as necessary
 5 Main motor failure – replace main motor
 4+ 57.1 Gears are seized, main motor is bad or DC controller is bad
 4Si/IIISi 57.1 Gears seized, defective top cover switch, faulty AC interlock switch, J010 loose or faulty, bad main motor PCA

Error 58
 4/4L/4P/4V/5/5P Check the fan cable – reseat the cable or replace the fan
 4V/4MV Defective DC controller board – replace dc controller
 4Si/IIISi 58.1/58.2 Paper cassette is impoperly inserted
 5Si 58.X Tray/Lifter Malfunction if X=1: Tray 2 lifter, X=2: Tray 3 lifter, X=3: Tray 1 lifter, X=4: Tray 4 lifter Press SELECT to continue

Error 59 Add Memory
 4Si/IIISi Not enough memory for PostScript option. Verify SIMM’s are seated properly, replace any defective SIMMS
 5Si 59.X Main motor malfunciton X=1: Main motor startup failure, X=2: Main motor rotation failure

Error 62.X
62.0 Service, 62.1-4 Service, 62.5 Service, 62.6 Service All Printers
 1. Improperly seated SIMMs or font cartridge – remove, check and clean the contacts, re-install and try again.
 2. Defective Internal Memory – Replace the Formatter PCA.

Error 67 Defective formatter PCA
 2/2D/2P/2P+/3/3D/3P/4/4+/4P – Defective formatter board, try reseating the connectors and any accessories you may have plugged in to it, turn power off first!
 On the 4Si it could be a temporary error which can be corrected by cycling the power
 4V/4MV – Most common cause is a defective paper guide plate assembly.
 5Si The field replaceable units (FRU’s) not installed correctly. Check and reinstall.

Error 79
 Software/drivers, Memory PCA’s, Font-Macro-Personality Cartridges, option I/O Cards. Defective toner cartridge in the Laserjet 4 Plus only. Remove any accessories (font cartridges, memory PCA’s, SIMMs, etc.) plugged into the formatter card and try again. If the problem persists and is application specific, verify proper setup with application vendor.
 Defective Formatter PCA – Replace with known operational board and try again.

Error 80
 Improper MIO connection – look at pins on formatter MIO connection
 Defective MIO Card – Replace card
 Defective Formatter Card – Replace card

Error 89
 The PostScript ROM’s have bent or broken pins inspect the pins and reseat if necessary
 Check to see that the ROM SIMM’s are in the proper location and oriented properly
 This can also be a temporay error, try power cycling the printer
 The PostScript ROM’s/SIMM are defective